SERVICES
Strategy 可行性设计 feasibility design turnkey service IP/PDK/technology vs. chip/package/substrate/test​
Inputs 功能概念: functional block key IP diagram schematic circuitry chip/package partition​
Results 布图规划: physical layout/stack, constraints, DFx 電氣评估: PI-power, SI-signal, ESD, …
IP/芯片/封装 co-design
协同设计策略 & ecosystem
China representative: 北京淇芯科技
&
Taiwan RD teams: 沅顧科技